A new class of electronic devices.

Phiar’s low cost, nano-scale devices take performance beyond the physical limits of semiconductors. Phiar’s metal-insulator technology can be integrated into supporting CMOS chip dies, or manufactured on a wide range of other substrates. Natively operating from
DC to 3 THz, Phiar’s technology is a compact, practical replacement for costly compound semiconductors in GHz applications and cryogenic devices in the emerging THz field.

Motorola and Phiar complete joint development agreement for mm-wave detectors; metal-insulator commercialization efforts gain momentum
Top Story (Oct. 31, 2007) in EE Times. See the latest on the Press Page.